iNEMI TV

INEMI: Packaging: Cooling the Future: TIM Strategies for High-Density AI and HPC Platforms
INEMI: Packaging: Cooling the Future: TIM Strategies for High-Density AI and HPC Platforms
inemi INEMI LTSPR Project Phase 3a EoP - Session 2
inemi INEMI LTSPR Project Phase 3a EoP - Session 2
Packaging Tech Topic Series: Electronic Processes for the ExtremeEdit
Packaging Tech Topic Series: Electronic Processes for the ExtremeEdit
INEMI Sustainable Tech Topic: Answering the Burning Questions: Sustainable Flame Retardants
INEMI Sustainable Tech Topic: Answering the Burning Questions: Sustainable Flame Retardants
Smart Manufacturing tech topic series agentic ai for smart manufacturing 20251016
Smart Manufacturing tech topic series agentic ai for smart manufacturing 20251016
Smart Manufacturing Tech Topic: Agentic AI as Fuel for the Digital Twin Engine at Datacenters
Smart Manufacturing Tech Topic: Agentic AI as Fuel for the Digital Twin Engine at Datacenters
Packaging Chiplet Bonding oct01
Packaging Chiplet Bonding oct01
Semi Sustainability Sept15global programs for global impact 20250915 100454 meetin pro vQr1knez
Semi Sustainability Sept15global programs for global impact 20250915 100454 meetin pro vQr1knez
Board Assembly Roadmap Webinar (September 4, 2025)
Board Assembly Roadmap Webinar (September 4, 2025)
INEMI Smart Manufacturing-PCB Design and Bare Board Manufacturing: Digital Twin or Digital Win?
INEMI Smart Manufacturing-PCB Design and Bare Board Manufacturing: Digital Twin or Digital Win?
INEMI Smart Manufacturing: Security by Design in Smart Manufacturing & Supply Chains (Alcon)
INEMI Smart Manufacturing: Security by Design in Smart Manufacturing & Supply Chains (Alcon)
INEMI Printed Circuit Board Roadmap, Tarja Rapala (EIPC) and Joe Beers (Gold Circuit Electronics)
INEMI Printed Circuit Board Roadmap, Tarja Rapala (EIPC) and Joe Beers (Gold Circuit Electronics)
Sustainable Electronics Tech Topic Series: PCBs and Sustainability
Sustainable Electronics Tech Topic Series: PCBs and Sustainability
INEMI Interim Report: Interconnection Modeling & Simulation Results—LTM in 1st Level Interconnect
INEMI Interim Report: Interconnection Modeling & Simulation Results—LTM in 1st Level Interconnect
NEMI Electromigration of SnBi Solder for Second-Level Interconnect, Part 2
NEMI Electromigration of SnBi Solder for Second-Level Interconnect, Part 2
INEMI Smart Manufacturing Tech Topic Series: Enhancing Yield and Quality with Explainable AI
INEMI Smart Manufacturing Tech Topic Series: Enhancing Yield and Quality with Explainable AI
INEMI Sustainable Electronics — Completing the Circle: Enabling New Life for Storage Infrastructure
INEMI Sustainable Electronics — Completing the Circle: Enabling New Life for Storage Infrastructure
INEMI Adhesives Characterization for Optical Packaging Project Webinar (May 14, 2025)
INEMI Adhesives Characterization for Optical Packaging Project Webinar (May 14, 2025)
INEMI Electronic Product Dataset Project Call-for-Participation Webinar (April 29, 2025)
INEMI Electronic Product Dataset Project Call-for-Participation Webinar (April 29, 2025)
Part 1: INEMI Electromigration of SnBi Solder for Second-Level Interconnect Project
Part 1: INEMI Electromigration of SnBi Solder for Second-Level Interconnect Project
INEMI’s BiSn-Based Low-Temperature Solder Process and Reliability (LTSPR) Project, Phase 3b
INEMI’s BiSn-Based Low-Temperature Solder Process and Reliability (LTSPR) Project, Phase 3b
INEMI / MIT Survey Results: Optical Adhesives for High-Volume Sustainable Photonics Deployment
INEMI / MIT Survey Results: Optical Adhesives for High-Volume Sustainable Photonics Deployment
INEMI RDL Adhesion Strength Measurement & Characterization Project
INEMI RDL Adhesion Strength Measurement & Characterization Project
INEMI Sustainable Electronics Tech Topic Series — IC Recovery and Reuse: Challenges and Potential
INEMI Sustainable Electronics Tech Topic Series — IC Recovery and Reuse: Challenges and Potential
iNEMI Roadmap Webinar on Sustainable Electronics (February 13, 2025)
iNEMI Roadmap Webinar on Sustainable Electronics (February 13, 2025)
iNEMI/IPC CIS Tech Topic Series: Complex Integrated Systems—The Future of Electronics Manufacturing
iNEMI/IPC CIS Tech Topic Series: Complex Integrated Systems—The Future of Electronics Manufacturing
iNEMI Packaging Tech Topic Series: Equipment Capabilities & Challenges to Support Advanced Packaging
iNEMI Packaging Tech Topic Series: Equipment Capabilities & Challenges to Support Advanced Packaging
iNEMI Sustainable Electronics Tech Topic Series Webinar: CEPN’s Toward Zero Exposure Program
iNEMI Sustainable Electronics Tech Topic Series Webinar: CEPN’s Toward Zero Exposure Program
iNEMI Packaging Tech Topic Series:
iNEMI Packaging Tech Topic Series: "Role of EDA in Advanced Semiconductor Packaging"
iNEMI Comparison of Expanded Beam & Physical Contact Connectors in Data Center Applications Project
iNEMI Comparison of Expanded Beam & Physical Contact Connectors in Data Center Applications Project