Скачать или смотреть Bondfilm HP® – High performance I/L bonding process for high performance products

With our market leading know how in oxide replacement technology, we have once again bushed boundaries and developed a new process that increases the copper loading, while reducing sludge to a bare minimum and without sacrificing on the great adhesion our traditional and well established BondFilm® process is known for. The new BondFilm® HP process sets the benchmark for a new era of cleaner, greener and more cost efficient brown oxides.

Our new drop-in solution reduces customers maintenance to an absolute minimum and allows for significant production cost savings., BondFilm® HP is tailored for high voltage applications and leadas to higher yields due to its extreme particle reduction. All this has been achieved neither compromising on process stability, nor quality.

Find more information about BondFilm® HP here:
https://www.atotech.com/products/elec...