Скачать или смотреть SEMATECH 3D Interconnect program - Plating tool

The Nexx Stratus300 is a fully automated electro-deposition system for advance packaging applications. It has a unique architecture with multiple plating baths that operate in vertical processing mode. This plating system could be used for solder bumps, Cu pillar, Redistribution Layers (RDL), Integrated passives, MEMs and others. SEMATECH currently uses it for Cu electro-deposition of high aspect ratio Through Silicon Vias (TSV) for 3D Interconnect applications. The operation starts by loading the FOUP. Wafers are picked by the front loader robot to the notch aligner and into the Bernoulli loader then into Wafer Holders. The Wafer Holders are then transported to the plating baths for plating.

Each Wafer Holder can hold two (2)wafers. The SEMATECH Stratus 300 has seven (7) plating baths which allows 14 wafers processed at the same time in similar plating bath composition for higher processing throughput. The multiple plating baths also allows the testing of different plating chemistries for Research and Development purposes.

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