High-Speed Wafer Feeder Flip Chip and Bare Die Process

Описание к видео High-Speed Wafer Feeder Flip Chip and Bare Die Process

This video features our FuzionSC™ and High-Speed Wafer Feeder, demonstrating a bare die process application. The bare die application process involves using semiconductor dies—tiny blocks of semiconducting material on which functional circuits are fabricated—without packaging them in traditional protective enclosures. This process has a wide range of applications across advanced electronics and technology fields, including Advanced Microelectronics, Microprocessors and GPUs, MEMS (Micro-Electro-Mechanical Systems), Implantable Devices, Aerospace and Defense, Consumer Electronics, and telecommunications.

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