Real-time x-ray 3D inspection of bga ic and pcb - part 2

Описание к видео Real-time x-ray 3D inspection of bga ic and pcb - part 2

BGA inspection (Ball Grid Array Inspection) is necessary to detect and isolate process defects between a chip and circuit board. BGA inspection looks for a variety of ball grid array problems during process development or the quality process.

Both BGA inspection look for a variety of defects during process development or the quality process, including:

Cracked Solder Joints
Excess Flux
BGA Separation
Bridging
Cold Solder Joints
Solder Pads
Contamination
Empty and Open
Improper Solder Paste Replacement
Joint Cracking
Ratcheting
Non-Contact

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