Скачать или смотреть 3D Printing Tech Turns Metal Into Floating Circuits! Here's How😱

3D Printing Tech Turns Metal Into Floating Circuits! Here's How😱

Researchers at the National University of Singapore (NUS) have developed CHARM3D, a groundbreaking system capable of 3D printing metal circuits in mid-air — without support materials or external pressure.

How CHARM3D Works

CHARM3D stands for Conductive High-Aspect-Ratio Metal 3D printing. The system uses Field’s metal, a non-toxic alloy made of indium, bismuth, and tin with a melting point of just 62°C. This low melting temperature allows molten metal to solidify quickly during printing, enabling the creation of self-supporting metallic structures suspended in mid-air.

The method relies on tension between the molten metal at the nozzle tip and the already printed structure, which keeps each droplet or filament stable as it solidifies. This eliminates the need for support scaffolds and enables smooth, uniform microwires about 100–300 microns thick — roughly the width of a few strands of human hair.

Advantages and Capabilities

Compared to traditional techniques like Direct Ink Writing (DIW), CHARM3D achieves:
• Printing speeds up to 100 mm per second
• High electrical conductivity resembling bulk metal
• Self-healing and recyclable circuits that can restore themselves after mechanical damage
• Compatibility with additive integration of components in vertical, compact 3D layouts.

Potential Applications

CHARM3D can fabricate 3D circuits for:
• Wearable, battery-free health sensors embedded in smart clothing
• Wireless communication antennas for vital-sign monitoring
• Electromagnetic metamaterials that manipulate waves for advanced signal processing or stealth technology.

Impact

Associate Professor Benjamin Tee and his team at NUS’s College of Design and Engineering describe CHARM3D as a “game-changer for electronics”, with applications in healthcare, communication, and security sectors. The technique, published in Nature Electronics in 2024, signals a shift toward compact, freeform electronics that can literally be “drawn” into existence in three dimensions.

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