CES: Electronics and PCB Thermal Analysis in NX and Solid Edge

Product thermal failures and significant late-stage design rework due to prototype thermal testing are costly issues that prove the value of learning and applying good design practices for thermal management of electronics products in the design cycle. Thermal simulation for electronics cooling allows engineers to predict airflow and temperature of electronic components earlier in the development process, ensuring reliable performance in the field. This webinar will cover new features for modeling PCBs in high detail to resolve trace and via conduction paths. It will also cover detailed IC modeling directly in the NX and Solid Edge environment, as well as PCB enclosure design with airflow management in mind.

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