Скачать или смотреть Accelerating Chiplet Integration Through ASE VIPack™ and Arm Total Design Collaboration

Lihong Cao Sr Director - ASE Group, Sridhar Valluru -

ASE is enabling scalable chiplet integration for AI and cloud systems through VIPack™ advanced packaging technology in collaboration with Arm Total Design (ATD) and the broader chiplet marketplace. VIPack™ platform featuring FOCoS, 2.5D-3D integration, and Co-Packaged Optics, supports high-density die-to-die connectivity and heterogeneous packaging aligned with OCP and UCIe interoperability goals. 

To streamline the development, ASEs IDE 2.0 bridges the gap between silicon and system-level design, offering early co-design, electrical and thermal modeling, and automated verification to reduce risk and time. 

ASE and Arm propose a collaborative initiative with OCP and ATD stakeholders to define a reference chiplet design and packaging flow based on ecosystem standards. This includes substrate templates, signal integrity practices, and co-design checkpoints to simplify SoC integration and accelerate innovation for hyperscale, edge, and automotive applications.