Scribing and Cleaving Wafers with LatticeGear LatticeAx, FlipScribe and FlexScribe

Описание к видео Scribing and Cleaving Wafers with LatticeGear LatticeAx, FlipScribe and FlexScribe

Scribing and cleaving is used for a wide variety of wafer types and shapes. See examples of GaAs, sapphire, silicon, glass and other wafers and substrates that were indented, scribed and cleaved using LatticeGear tools (LatticeAx, FlipScribe and FlexScribe)

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