2023 09 07 群創光電跨足半導體封裝 打造FOPLP產業鏈

隨著物聯網、人工智慧、自駕車、高速運算、智慧城市、5G等對異質整合封裝需求增多，半導體製程的線寬線距越來越小，傳統封裝已無法因應，不同功能的晶片異質整合封裝在一起將取而代之，面板級扇出型封裝成為異質型封裝的市場主流。
以3.5代產線，達成低翹曲/高解析之面板級導線層技術，實現全球第一條面板產線轉型封裝應用，業界首創。
With the increasing demand for heterogeneous integration packaging in fields such as the Internet of Things (IoT), artificial intelligence (AI), autonomous vehicles, high-speed computing, smart cities, and 5G, the semiconductor manufacturing process has seen shrinking linewidths and line spacings.

Innolux has leveraged its panel production lines for IC packaging. Benefitting from the square shape, which offers higher utilization compared to the circular shape of wafers, the utilization rate has reached 95%. Utilizing the industry's largest G3.5 FOPLP (Fan-Out Panel-Level Packaging) glass substrate, Innolux has developed advanced semiconductor packaging with fine linewidths for mid-to-high-end applications.