Скачать или смотреть Cold Bump Pull (CBP) 80µm cavity by force controlled USB Tweezers, Condor Sigma

Cold Bump Pull (CBP) testing with the XYZTEC USB Tweezers provides unparalleled precision and control. The bond of many solder balls is at the bottom of a cavity formed by solder resist layer. In a shear test this supports the bond, resulting in a predominance of solder shear failure modes. In a pull test the bond is not supported in this fashion, leading to the possibility of more relevant failure modes. Special jaws are required to grip the ball. These reform the upper part of the ball to enable the pull load to be applied without disturbing the bond.
https://www.xyztec.com/test-types/col...

The Condor Sigma is the most advanced bond tester on the market, combining the unique strengths of the Condor series with the latest technologies and innovations. Whether you need a dedicated or multipurpose bond tester, the Condor Sigma is the best choice featuring unparalleled 0.075% accuracy, the best ergonomics, highest throughput, maximum flexibility and the lowest cost of ownership.
https://www.xyztec.com/condor-sigma/