Ring or Mesh, or other? AMD's Future on CPU Connectivity

AMD's Hot Chips presentation on Zen 3 answered a question we'd been asking the company for a while, but the answer is quite unfulfilling. What does this mean in the grand scheme of things about AMD's evolution on its core chiplet designs?

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0:00 AMD At Hot Chips
0:23 Sponsor: Linode! http://www.linode.com/techtechpotato
0:59 Section 1: Gotta Connect 'em all
- 1:32 Four Elements
- 3:05 Bidirectional Rings
- 3:31 Six Elements
- 4:28 Eight Elements
- 5:20 A 2D Mesh
- 6:22 Eight Sockets
- 7:49 Crossbars
- 8:54 Ring Crossbar
- 9:13 Switching Crossbar
- 9:35 Add a bit of 3D with a Butterdonut
11:28 Section 2: AMD's Future
- 13:15 Scaling to EPYC
- 14:20 AMD IO Die
- 14:54 Bisected Rings
- 16:11 Add more chiplets
- 16:30 Intel's Biggest Ring
- 17:46 Is it really?
- 18:52 Scaling a Bisected Ring
- 19:32 3D Stacking
23:34 Interconnect Power and Consumer Chips

Shoutout to Adored's video tackling the subject in mid-2018:    • Interposers, Chiplets and...ButterDon...  
Research paper about Butterdonuts: https://www.eecg.utoronto.ca/~enright...

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AMD Ryzen 5 5600X (6C/12T): https://geni.us/5600X

Intel Core i9-10900K (10C/20T): https://geni.us/Bench2020-10900k
Intel Core i7-10700K (8C/16T): https://geni.us/Bench2020-10700K

AMD Ryzen 9 3950X (16C/32T): https://geni.us/Bench2020-3950x
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