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Principles and Applications of Room-Temperature Wafer Bonding
Room-temperature wafer bonding is a technology that enables wafer-level integration and sealing at ambient temperature. It relies on forming direct chemical bonds between homogeneous or heterogeneous wafers without high-temperature annealing or intermediate adhesives.
The technology is compatible with 4-inch to 12-inch wafers.
Compared with traditional high-temperature bonding, room-temperature bonding provides significant advantages:
• No thermal deformation and no thermal stress
• High bond strength and high reliability
• Simple and efficient process flow
• Excellent for heterogeneous material integration
• Strong environmental adaptability
• Applicable to almost all semiconductor materials
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End-Application Fields
Room-temperature wafer bonding is widely adopted in microelectronics and sensor manufacturing, enabling hermetic sealing and heterogeneous integration. Key application areas include:
• SAW communication filters
Leading global manufacturers such as Murata and TDK use room-temperature bonding to produce their high-performance SAW filters for smartphones, ensuring stable procurement orders from Apple.
• Pressure sensors
• MEMS micro-electromechanical systems
• Optoelectronics and photonic integration，Room-temperature wafer bonding is driving innovation in 5G, electric vehicles (EVs), and biomedical technologies, and is considered one of the key mainstream bonding technologies of the future.
#Room-Temperature Wafer Bonding
#Semiconductor Equipment
#Vacuum Surface-Activated Bonding
#Damage-Free, Stress-Free Wafer Bonding
#Composite Wafer Substrates
#SAW Filter Manufacturing
#IGBT Power Chip Manufacturing
#Pressure Sensor Manufacturing
#Piezoelectric Sensor Manufacturing
#MEMS Micro-Electromechanical Systems Manufacturing
#Next-Generation Wafer Bonding Technology