Скачать или смотреть Installation Process of SnapShot® Board Level Shield

The shields are attached to the PCB via a patented attachment mechanism utilizing individual BGA solder spheres. The shield is installed when oval holes around the shielded cavity perimeter “snap” over solder spheres that have been reflowed to the ground plane.

After the solder spheres are permanently soldered to the ground plane during reflow, the shield is aligned with an installation tool and pressed down into place.


The shield flexes as the holes around the cavity perimeter are forced over the solder spheres with the use of an installation tool.


Once the shield passes the midpoint of the sphere, the natural forces pull the shield down to the board and exert continuous force to keep the shield in place.


Visit https://xgrtec.com/snapshot/ for more information.