ROHS compliance and Difference between ROHS and Non- ROHS solder

In this video I explained what is ROHS and restricted substance by EU. I also explained the difference between ROHS and Non-ROHS soldering.

The use of lead-free solder in electronics is becoming more common as manufacturers continue to comply with the ROHS directives. There are similarities in the soldering practices for both ROHS and non-ROHS solders; however, the ROHS soldering process requires a different approach and more care.

Good practices such as having clean pads, a clean soldering iron tip, and allowing the solder connection to cool undisturbed are common for both solders.

Differences between the lead-free and lead-based solders

Soldering Temperature

The lead-free solders melt at higher temperatures of about 217°C/422°F compared to 183°C/361°F for the lead-based option. The PCB materials and electronic components must therefore be able to withstand the higher temperatures.

Due to the high soldering temperature, one must remove the soldering iron more quickly to avoid icicles, damaging the components or the tracks.

Inferior wetting properties

The wetting of ROHS solder takes longer and is worse on dirty, oxidized surfaces; in addition, this solder does not spread as much as the lead-based option. Increasing the temperature improves the wetting; however, the high temperatures shorten the soldering iron tip life, and may damage the PCB and the components.

A more aggressive flux may also be used to improve the wetting. In this case, a thorough post-solder cleaning should be done to prevent flux-related problems such as corrosion, dendritic growth, poor adhesion of the conformity coatings, and electromigration, which can cause short circuits between circuit traces.

Tin/Lead Tin/Silver/Copper
Melting temperature 183°C 217°C
Time taken to wet clean copper at 23°C above melting point 1.5 seconds 4.0 seconds

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