Скачать или смотреть Global Semiconductor Packaging Materials Market 2016-2020

Link to Report: http://bit.ly/23GJl7P

Technavio’s market research analyst predicts that the global semiconductor packaging materials market will grow at a modest CAGR of close to 5% during the forecast period. One of the primary drivers for this market is the increasing miniaturization of electronic devices. To make electronic devices portable and cost effective, they need to be compact and lightweight. Packaging technologies like SiP, flip-chip, and WLP drive the development of new material solutions. This ensures that high density and improved performance is possible in miniaturized packages. Moreover, the increasing demand for compact electronic devices across various sectors like the telecommunications and the automotive industry will also play a significant role in propelling market growth through the forecast period.