Moldex3D IC Packaging | Automated Molding Simulation and Data Management for IC Packaging in iSLM

#Moldex3D #ICPackaging #datamanagement
Automated Molding Simulation and Data Management for IC Packaging Industry in iSLM Platform

Plastic chip encapsulation is a molding process where chips are being capsulated with epoxy molding compound (EMC) to prevent physical damage or corrosion. Common defects include incomplete fill, air traps, voids, wire sweep, paddle shift, package warpage, etc.

Moldex3D IC Packaging provides a complete series of molding solutions that help engineers to simulate the complex chip encapsulation process, validate mold design, and optimize process conditions.

⭐Highlight⭐
📍Current Moldex3D IC Packaging Simulation Workflow
📍Automated Simulation Workflow for IC Packaging Analysis
📍Solution Management of iSLM Data Platform
📍Extension of iSLM Cloud Service

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