Скачать или смотреть Webinar: Customized BSOI using CMOS compatible Wafergrinder | Fraunhofer IPMS

In this webinar we will talk about the increasing demand for BSOI wafers, coupled with the requirements for our sophisticated components, have led Fraunhofer IPMS to build up competencies in the field of BSOI manufacturing in recent years. In doing so, our approach addresses individualized solutions for our customers in BSOI wafer fabrication. The devicelayers are equipped with various features, such as an adapted layer thickness and adapted doping. Thanks to our many years of technological experience, add-ons such as cavities or buried conductor paths can also be integrated into the device layer. This enables our customers to make optimum use of resources and short process times in the development of sophisticated products.

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