Semiconductor Wafer Processing

Описание к видео Semiconductor Wafer Processing

Logitech offer a full system solution for the preparation of semiconductor wafers to high specification surface finishes prepared with precise geometric accuracy.

This video offers a step by step guide from measuring the initial thickness of the sample to safely bonding fragile wafers to a substrate for processing. The video also includes lapping, polishing and the measurement of the finished sample to safely de-bonding the sample from the substrate.

For more information visit our website: https://logitech.uk.com/
Or email us: [email protected]

Комментарии

Информация по комментариям в разработке

Похожие видео