Скачать или смотреть 3D IC Podcast | 3D IC Architecture & Design Flows

3D IC designs require integrating multiple chiplets into a single system which means they require much tighter collaboration with the packaging design team and throughout most of the product design cycle, including system design tools, models, and workflows. This episode of the Siemens 3D IC | The Future of semiconductor design podcast discusses the current state of 2.5 and 3D SiP design flows and the evolution required to support the design community to develop these 3D IC-based devices.

About Siemens 3D IC Design Flow: a comprehensive set of tools and workflows targeted to develop advanced 2.5 and 3D IC heterogeneous system-in-package (SIP) designs. Explore more about Siemens EDA's marketing-leading 3D IC technology solution: https://eda.sw.siemens.com/en-US/ic-p...

#chiplets #semiconductor #icpackaging #advancedpackaging #3DICdesign #3dic #ic #eda

LEARN MORE: https://sie.ag/3UK8NW4
►INDUSTRY PAGE: https://sie.ag/3DOf9yH
►CHIPLET MODEL WHITEPAPER: https://sie.ag/3P6vClC

FOLLOW US:
►BLOG: https://sie.ag/3sIVkCz
►LINKEDIN: https://sie.ag/3Fwoufo