WEBINAR: Thermal Management: Heat Pipes, HiK™ Plates, and Vapor Chambers

Heat pipes, high conductivity (HiK™) plates, and vapor chambers are two-phase technologies that are often considered for electronics cooling. All three devices rely on the very high evaporation and condensation coefficients of two-phase fluids to reduce the ΔT between the source and the sink for a given power. When properly engineered for power and mission duration, all of these devices provide passive, reliable cooling.
This webinar will provide engineers with an understanding of the fundamental parameters for all three devices, including operating principles, thermal performance, thermal conductivity, weight, and cost. Selection criteria will also be presented to help select the optimum device for your specific application. Finally, methods for modeling will be discussed, both quick modeling to determine suitability, as well as more accurate modeling for detailed design.

For more information on the presented passive thermal technologies, please visit www.1-ACT.com.

0:00 Introduction
1:59 Presentation Outline
2:47 Introduction
3:33 Heat Pipe Principles
4:44 Heat Pipe Demo
6:24 Two-Phase Performance Limits
8:18 Spot Cooling Heat Pipe Uses and Benefits
11:24 High Conductivity HiK Uses & Benefits
14:23 Vapor Chambers
15:14 Vapor Chamber Selection Parameters
16:45 Cooling Device Comparison
17:50 Selection - Wrap Up
19:38 Heat Pipe Limits
22:00 Online Calculator Resource
22:32 Heat Pipe Calculator Example
23:29 Heat Pipe Modeling: Thermal Resistance Network
24:28 Basic Conduction Rod
26:09 Summary