Скачать или смотреть 【SEKISUI】SELFA™ Temporary Fixing Material for Semiconductor Manufacturing

Introduction Video of the Automated Process Using SELFA™ UV Debonding Tape

SELFA™ is an excellent tape that combines strong adhesion with easy debonding.
It is a high-performance product that enables:

Superior performance (heat resistance, easy debonding, low residue)

High work efficiency (manufacturing automation)

Primarily used in semiconductor wafer and chip manufacturing, SELFA™ is now available in three product types designed for various processes such as package manufacturing, wafer support, and plating.

SELFA™ Product Information
https://www.sekisui.co.jp/electronics...

Semiconductor-related Products
https://www.sekisui.co.jp/electronics...

[Part 1] Lamination & Bonding

0:00 Introduction
0:18 Glass/Wafer Setup
1:17 Separator Removal
1:43 Wafer Placement in Chamber
2:09 Wafer-Glass Setup
2:38 Pre-UV → Storage

[Part 2] Debonding

3:03 Introduction
3:12 Debonder Equipment
3:23 GWSS Check
3:45 Post-UV
3:56 Glass Debonding
4:28 SELFA™ Removal
4:50 Wafer Storage

Sekisui Chemical Co., Ltd.
High Performance Plastics Company – Electronics Strategy Office
Semiconductor Materials Sales Department

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