Скачать или смотреть [SNAPCLEAN] — Non Contact Surface Cleaning for Electronics Manufacturing

SNAPCLEAN is MSTECH’s high efficiency non contact surface cleaning module for electronics manufacturing and SMT production. Built on TAIFUN CLEAN® technology, it prepares PCB surfaces with ionized air, rotating nozzles, and an integrated suction channel to remove particles and neutralize electrostatic charges—ideal before coating, bonding, or optical inspection.

Delivering stable, repeatable results on structured or 3D components, SNAPCLEAN integrates seamlessly into automated lines and the SMART INFINITY ecosystem. Custom working widths (100–2000 mm) and pressure independent rotation control ensure consistent performance across various throughput needs.

Key Features :

• Non contact cleaning with pulsating compressed air for PCB surface preparation.
• Dual ionization bars to eliminate ESD and improve adhesion quality.
• Integrated suction for controlled extraction and cleanliness assurance..
• Custom widths 100–2000 mm; operating pressure 1–5 bar, max temp 50 °C
• Compact design, easy inline integration, ideal for SMT/PCBA workflows.

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