Скачать или смотреть S38.2 Semiconductor Failure Analysis: Techniques, Causes, and Future-Ready Strategies (part 2)

v3-S38.2. Course Description:
This course explores the vital role of failure analysis in the semiconductor industry, emphasizing its impact on product quality, reliability, and innovation. Participants will examine the causes of semiconductor failures—including manufacturing defects, environmental stress, and electrical damage—and learn how these issues manifest in real-world scenarios. The course introduces key analysis techniques such as SEM, TEM, SAM, and FTIR, highlighting both destructive and non-destructive methods used to detect and diagnose root causes. Learners will follow the standard failure analysis workflow from detection to corrective action and understand how data-driven insights contribute to continuous improvement, cost reduction, and zero-defect manufacturing. Future-focused modules will cover the integration of AI, digital twins, and advanced metrology in predictive failure prevention. This course is ideal for professionals aiming to strengthen quality control, accelerate problem resolution, and drive innovation in semiconductor manufacturing.