Скачать или смотреть Why Metalized Aluminum Nitride Substrates are Ideal for Silicon Chips

"When it comes to silicon chip packaging, Metalized Aluminum Nitride (AlN) Substrate stands out due to its precise thermal expansion coefficient matching and fast heat conductivity. Its ability to withstand high temperatures and provide high insulation makes it an excellent choice for demanding applications. Our substrate's good thermal shock resistance and high reliability ensure longer lifespan and higher efficiency.

Partner with us for your silicon chip packaging needs and experience the difference.

Our Metalized AlN Substrate is processed using AMB, TFC, DPC, and DBC techniques to enhance its overall performance. Its compact design and large current carrying capacity make it perfect for modern electronics. Don't miss out on the benefits of our cutting-edge technology. Choose Metalized Aluminum Nitride Substrate for your next project."
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