Скачать или смотреть Unpacking 3D IC microarchitecture: Challenges, solutions, and the future of chiplet design

Join us for a deep dive into the fascinating world of 3D IC microarchitecture with Pratyush Kamal, Director of R&D for 3D IC Solutions Engineering at Siemens Digital Industries! This podcast explores the intricate details of designing for advanced chiplet ecosystems, addressing the complexities and innovations shaping the future of semiconductors.

In this episode, you'll discover:

What is Microarchitecture in 3D IC? Understand how hardware engineers implement system architecture, focusing on data and control flow across the 3D stack, and leveraging integration density.
Key Design Challenges: Explore critical issues like increased power density, thermal management, testability, debug, failure analysis, and the need for resilient circuits in 3D IC designs.
Enabling Early Decision-Making: Learn why early consideration of microarchitecture is crucial and how automation, integrated multi-physics analysis (electrical, mechanical, thermal), and predictive analysis are vital for cost-effective development.
Evolving Roles & Skills: Hear about the shift towards machine-centered flows, the role of AI and agentic AI, and the importance of cross-training and a broad skill set for designers in a non-siloed design practice.
The Future of 3D IC: Gain insights into heterogeneous integration, advanced memory access strategies (like non-unified memory access), thermal throttling, and the critical need for redundancy and failure-resilient systems to overcome adoption hurdles.
This session is a must-listen for IC designers, architects, semiconductor engineers, and anyone interested in the cutting-edge of 3D IC technology and advanced packaging.

For more information on the Siemens EDA Innovator 3D IC platform (winner of the 2025 Technology Enablement Award!), visit: https://sie.ag/3aiffh