Скачать или смотреть 3D IC Podcast | 3D IC Physical Design Workflow

One challenge teams face when designing 3D IC chips is managing data in different formats from difference sources. Teams need solutions that enable them to verify different components such as the interposer, the package and the die together. This episode of the Siemens 3D IC | The Future of semiconductor design podcast discusses what a 3D IC physical design workflow might look like, the challenges associated with 3D IC physical design and how a Siemens solution enables design teams to use data received in multiple, diverse formats.

About Siemens 3D IC Design Flow: a comprehensive set of tools and workflows targeted to develop advanced 2.5 and 3D IC heterogeneous system-in-package (SIP) designs.

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