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Common problems and solutions in the immersion gold process of rigid-flexible circuit boards

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Problem 1: Uneven gold plating.

Solution: Before performing the immersion gold process, make sure the substrate surface is clean and free of any contaminants.

Problem 2: The thickness of the gold layer is too large.

Solution: Control the immersion gold plating time and temperature to prevent the gold layer from being too thick.

Problem 3: The adhesion between gold plating and the substrate is poor."

Solution: Properly roughen the surface of the substrate before the immersion gold process to improve adhesion.

Problem 4: White spots or pits in the gold layer.

Solution: Ensure that the pre-treatment processes, such as cleaning and activation, are carried out thoroughly to prevent any surface defects that can lead to white spots or pits in the gold layer.

Problem 5: Black pad phenomena (formation of brittle Au-Sn intermetallic compounds) during soldering.

Solution: Follow the recommended plating thickness and control the pH levels and concentration of the immersion gold solution to prevent the formation of intermetallic compounds. Additionally, consider using alternative surface finishes in areas susceptible to soldering, such as using selective plating or applying a different surface finish, such as ENIG (Electroless Nickel Immersion Gold).

Remember, the immersion gold plating process for rigid-flex circuit boards requires careful attention to detail and adherence to correct procedures. By employing effective solutions to common problems, you can achieve high-quality gold plating on your circuit boards.”
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