Скачать или смотреть Frore Systems AirJet Mini G2 at Computex 2025 doubles laptop performance, 7.5W solid-state cooling

AirJet Mini G2 marks Frore Systems’ second-generation solid-state active cooling chip. It retains the original 27.3 × 41.6 mm footprint while slimming to 2.5 mm and boosting heat removal from 5 W to 7.5 W thanks to 1750 Pa back-pressure membranes that whisper at 21 dBA and weigh only 7 g. Built on semiconductor tooling, the device outperforms comparably sized fans and keeps enclosures sealed against dust and water, opening new thermal headroom for mobile, edge and embedded platforms. https://www.froresystems.com/airjet-m...

The core technology is a piezoelectric membrane array that pulses incoming air through micro-channels, creating high suction and directional jets without moving blades. Because production follows wafer-level processes, Frore claims a “Frore’s Law” cadence—doubling thermal performance every two years—mirroring transistor road-maps rather than mechanical cooling iterations. Precision lithography, new polymer composites and revised cavitation geometries together supply the 50 percent generational gain.

Gen 2’s plug-and-play format lets designers or tinkerers swap a fan or heat spreader for a 7 g device that stays silent, vibration-free and IP-rated. High back pressure means the chip can breathe through fine meshes, so sealed gadgets remain thin, quiet and spill-tolerant while avoiding dust cake that degrades fins and bearings over time.

A pocket-sized 5 G Wi-Fi hotspot illustrates the payoff. The original unit overheated and disconnected after half an hour; replacing its thermal pad with one AirJet Mini G2 allowed day-long multi-user Teams calls with zero throttling. The only visible change is a tiny exhaust vent, yet the modem, SoC and memory now operate at steady thermals.

On a manufacturing line, a high-resolution infrared camera upgraded with Gen 2 dropped its sensor from 44 °C to 15 °C, sharpening wafer-defect imaging and reducing false rejects. Stable focal-plane temperature translates directly into tighter process control and faster inspection throughput.

In storage, a Thunderbolt 5 external SSD fitted with one chip sustains the full 6 GB/s read-write envelope instead of falling to 3 GB/s under load. Multi-drive RAID enclosures targeting 12 NVMe modules can adopt the same 2.5 mm coolers without enlarging the chassis, and IP53 inlet filters keep abrasive dust away from valuable NAND.

Personal computing gains are equally stark. A Samsung Galaxy Book retrofitted with Gen 2 doubled sustained CPU power from 12 W to 24 W while remaining acoustically identical to silent mode. A Xiaomi 14 phone used for gaming stayed 15–20 °C cooler to the touch. For embedded AI, the AirJet PAK module packs five chips, removing 30 W from NVIDIA Jetson Orin or AMD Versal boards so edge inference engines can run larger reasoning models without an audible fan.

From mini PCs delivering on-device LLM reasoning to forthcoming laptops and tablets, Frore’s solid-state jets are erasing the last thermal bottleneck in ever-thinner systems. As products ship and volumes rise, the company positions AirJet not as a niche cooler but as a scalable fabric enabling silent, dustproof, high-density computing across client, industrial and eventually data-center markets.

My full Computex 2025 video coverage is here:    • Computex 2025 full coverage  

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