Скачать или смотреть Automatic die bonder for LED/IC package/Semiconductor packaging equipment/China Low price equipment

Guangzhou Minder-Hightech Co.,Ltd
MINDER-HIGHTECH CO.LIMITED HONGKONG
Address:Room 605,Building 3, No 31,Bangjiang East village , Shilian Road, Dalong street, Panyu District，Guangzhou, China

Product Description:
Die bonding for surface substrate of semiconductor,LED,COB,IC etc.
Automatic Dual-Magazine upload and download system. adjustable of the width of work stage. quality check function after bonding.

Basic function:
Die dimension:6*6mil-100*100mil
Substrate:SuRface LED, SMD(0603,0805,1010),TOP SMD(3528,5050 etc)
System:Windows XPLanguage:Chinese/English
Min working time:160ms/cyclePosition accuracy:+-1.5mil
Angle accuracy:+-3 degreeInput voltage:220V,50Hz,0.9kw
Air compressor:3-5kgf/cm2

Other function:
1,Die lost check.
2,Limitless schedule quantity storage.
3,Lcd color display and touch screen.
4,Built-in vacuum generator.
5,Optional external UPS.

Quality test:
1,Glue dimension test.
2,Die position test.
3,Die angle test.

Glue dispensing system:
1,XY adjustable dispensing, constant temperature dispensing arm.
2,Automatic load and unloading system, magazine.
3,Width:30mm-75mm adjustable.