microDICE - Wafer dicing system for SiC

Описание к видео microDICE - Wafer dicing system for SiC

The revolutionary, high-performance microDICE laser
dicing system brings TLS-Dicing technology (Thermal-
Laser-Separation) to semiconductor‘s back-end.
The microDICE separates wafers, including SiC, into dies
with an outstanding edge quality while increasing the yield
and the throughput.

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