DVD - Lecture 10d: System-in-Package (SiP)

Bar-Ilan University 83-612: Digital VLSI Design

This is Lecture 10 of the Digital VLSI Design course at Bar-Ilan University. In this course, I cover the basics of Chip Implementation, from designing the logic (RTL) to providing a layout ready for fabrication (GDS).

Lecture 10 covers the basics of IC packaging and the interface to the outside world through Input/Output (I/O) circuits.

Lecture 10d provides a high-level overview of the system-in-package (SiP) concept from multi-chip modules (MCM) through various 2.5D and 3D integration technologies.

Lecture slides can be found on the EnICS Labs web site at:
https://enicslabs.com/academic-course...

All rights reserved:
Prof. Adam Teman
Emerging nanoscaled Integrated Circuits and Systems (EnICS) Labs
Faculty of Engineering, Bar-Ilan University