IC Packaging Industry Trends and Moldex3D Solutions｜Intro

#Moldex3D #Webinar2024｜IC Packaging Industry Trends and Moldex3D Solutions｜Intro

In the thriving semiconductor industry, the complexity and precision requirements of IC packaging have become increasingly vital due to the demands of advanced processes. This webinar will provide an overview of the challenges faced by the IC packaging industry, as well as the technological trends in advanced packaging and processes. It will also offer a brief introduction of the digital twin solution provided by Moldex3D IC Packaging.

What You Will Learn
An overview of the IC packaging industry challenges
Technological trends in advanced packaging
An introduction of Moldex3D IC Packaging solutions

If you want to watch the full version, please visit the page below:
https://university.moldex3d.cloud/#/o...
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IC Packaging, Encapsulation

CoreTech System Co., Ltd. (#Moldex3D) was founded in 1995, it has provided the professional plastic injection molding simulation solution “Moldex” series for the plastic injection molding industry, and the current product “Moldex3D” is marketed worldwide.

Committed to providing the advanced technologies and solution for industrial demands, CoreTech has extended the worldwide sales and service network to provide local, immediate, and professional service. Nowadays, CoreTech presents the innovation technology, which helps customers to troubleshoot from product design to development, to optimize design pattern, to shorten time-to-market, and maximize product ROI.

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