Скачать или смотреть The Siemens SIPI approach: From feasibility to final closure in 3D IC design – podcast ep. 15

How do you ensure clean, stable power and reliable signal transmission in a dense 3D IC stack without introducing late-stage surprises?

In this episode of the Siemens 3D IC Podcast, host John McMillan sits down with John Caka, Principal SIPI Engineer at Siemens EDA, to explore why signal integrity and power integrity (SIPI) analysis are more vital than ever in 3D IC workflows and why progressive verification is key to managing complexity at every stage of design.

Together, they unpack the evolving demands of SIPI in 3D IC architecture, from early planning to vendor-specific IP verification. You'll learn how multidisciplinary teams—spanning layout, thermal, mechanical, electrical, and packaging—must align in parallel to make next-gen designs successful.

This episode also shares behind-the-scenes insight into Siemens' recent collaboration with Chiplets, highlighting the EDA tool flexibility and scalability needed for today's massive pin-count designs.

Whether you're an SIPI engineer, 3D IC architect, IC packaging team member, die designer, layout specialist or system-level verification professional, this episode is for you!

What you'll learn in this episode:
• What SIPI means and why it's essential for 3D IC reliability (1:40)
• How 3D design shifts traditional SIPI workflows and stakeholder roles (3:20)
• What progressive verification looks like in practice—from architectural feasibility to detailed modeling (5:55)
• How new standards like UCIe and AIB add flexibility—and ambiguity—to the design process (9:20)
• The real-world challenges Siemens overcame with Chiplets, a smart substrate startup (11:35)

Connect with John Caka LinkedIn: https://sie.ag/28Gm2e
Connect with John McMillan LinkedIn : https://sie.ag/33WFcz

About Siemens 3D IC Design Flow: a comprehensive set of tools and workflows targeted to develop advanced 2.5 and 3D IC heterogeneous system-in-package (SIP) designs.

Explore more about Siemens EDA's marketing-leading 3D IC technology solution: https://sie.ag/u9CSQ

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