Скачать или смотреть SMT pick&place machine SIPLACE CA2 - buffer storage for high-speed.

SIPLACE CA2 - buffer storage for high-speed.
Die placement directly from the wafer:
Integrating this complex process into a high-speed SMT line
has often failed due to insufficient performance.
This is because the pre-separated dies must first
be carefully removed from a carrier film.
This time-consuming process can hardly be accelerated.
We have solved this problem with the SIPLACE CA2,
which uses a buffer memory similar to a placement head.
It decouples and parallelizes the processes of picking up
the die from the wafer and placing it on the substrate:
16 buffer pipettes are supplied with new dies
by the flip unit with its four pipettes while the placement
head is still working. This means 20 dies are available when
the placement head is ready to pick up again.