Скачать или смотреть Electroless plating equipment for wafer to make UBM “TORYZA EL SYSTEM”

Okuno has been developing and manufacturing surface treatment and plating chemicals for over 60 years. As we expand our product line for the semiconductor industry, we believe it is important to offer a total solution of plating chemicals, surface treatment processes and equipment for this field. Therefore, Okuno has launched a new brand for semiconductor back-end processes, TORYZA.

TORYZA EL PROCESS is a plating process for forming UBM on aluminum electrodes of wafers by electroless nickel plating after zincate treatment. We offer the best solution, not only chemicals but also the automatic plating equipment for UBM formation, "TORYZA EL SYSTEM". TORYZA EL SYSTEM is designed and developed in cooperation with an equipment manufacturer based on the know-how we have acquired as a plating chemical supplier.