Скачать или смотреть World`s smallest SMD component 008004 pick and place process

Miniaturization of electronic devices requires highly accurate procedures in all areas of surface mount technologies and manufacturing.

Recent development on our pick-and-place systems improved the accuracy of the machine`s placement process to ± 40 µm (3σ) XY chip and ± 30 µm (3σ) XY QFP.

The latest improvements on the EVO feeder generation 4 mm tape, and the ePlace software advancements increase accuracy of the component placement down to 008004 (imp.) 0,25 x 0,125 mm.

Fox and Puma systems support a wide range of components from 008004 up to 80 x 80 mm.

Note the Specification sheets for details or contact our service team for support.

More info: https://essemtec.com/en/contact/