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Foundry Services Overview

Design/DFM Services
Design For Manufacturing
Design Enabled Manufacturing
2.5/3D Design

Prototyping Services
Tapeout & Masking Services
GlobalShuttle MPW
IP Validation

Product Engineering Services
Product/IP Skew
New Product Introduction
Yield/Diagnostics
Quality and Reliability

Turnkey Services
Bumping
WaferSort
Turnkey Assembly & Final Test
2.5D/3D Enablement
Presenters

Eelco Bergman is the Director of Product Marketing responsible for GLOBALFOUNDRIES advanced inter-connect offering, encompassing wafer bumping, 2.5D/3D TSV and turnkey services. Eelco has 30+ years of semiconductor packaging experience with leading companies including Amkor Technology and Micron.

Vito Dai is a PMTS DFM CAD Engineer at GLOBALFOUNDRIES, where he is responsible for pattern-based and lithography model-based DFM. He was one of the co-inventors of the patented DRC+ technology, which revolutionized physical verification using 2D pattern matching. He entered the field of DFM and OPC when he joined AMD in 2005, and he received his Ph.D. in electrical engineering at University of California in Berkeley in 2008.

Charlie McDonald is the Director of Product Marketing responsible for GLOBALFOUNDRIES' test and product engineering services. Charlie has 30+ years of semiconductor industry experience with leading companies including LSI and Nvidia.