Huawei making advanced chips without ASML EUV lithography machines?

Huawei has made an extraordinary breakthrough in semiconductor technology, achieving advanced chip production despite U.S. sanctions and restricted access to ASML EUV lithography machines. The Kirin 9000S chip, powering Huawei’s Mate 60 Pro smartphone, was fabricated using a 7nm process by SMIC. This milestone, accomplished with DUV lithography, demonstrates China’s growing ability to innovate under geopolitical constraints.

ASML EUV machines, essential for cutting-edge chipmaking, were bypassed by Huawei’s reliance on DUV technology, which uses multiple patterning techniques to achieve advanced nodes. Although this process raises production costs and lowers yields, Huawei’s success with the Kirin 9000S proves the viability of alternative approaches in semiconductor manufacturing.

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