IEDM: Enabling Hybrid Bonding on Intel Process

Описание к видео IEDM: Enabling Hybrid Bonding on Intel Process

0:00 Introduction
0:54 Packaging Trends
2:01 Enabling Pitch Scaling Beyond 10 pm
2:49 HBI Circuit Benefits
3:56 HBI Improvements over Solder Attach
4:41 HBI Assembly Types
5:44 Holistic View of HBI on Advanced Process Nodes
6:18 Interconnect Parasitics
7:16 RF Inductors & Transformers Impact
8:43 Other Considerations
9:13 Wafer Processing Steps & Stackup
9:37 Bow Control
10:05 Surface Roughness & Topography
11:34 Improving Placement Accuracy
12:14 Particles Impact
13:07 Particle Control
13:42 Die to Wafer Assembly: Test
15:38 Active Test Chip
16:29 Passive Test Chip Results
17:16 Conclusion
18:08 Future Considerations

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