Скачать или смотреть GaAs Wafer Backgrinding

We specialize in the R&D, production, and sales of ultra-precision flat surface processing equipment for the semiconductor industry. Our solutions address diverse process challenges across semiconductor materials, delivering integrated equipment + process packages. Key applications in semiconductor manufacturing include: grinding, double-side polishing, single-side polishing, thinning, and CMP (Chemical Mechanical Planarization). These technologies are widely adopted in semiconductor substrates, devices, wafer fabrication, advanced packaging, and other critical manufacturing stages.

#semiconductor #wafer #Wafer Grinding #WaferThinning #SiliconWafers
#SiliconCarbide#CMP#Wafer Cleaning