Seal Integrity Testing Utilizing Non-Destructive Capacitive Sensing for Product Packaging Assurance

Sponsored by IEEE Sensors Council (https://ieee-sensors.org/)

Title: Seal Integrity Testing Utilizing Non-Destructive Capacitive Sensing for Product Packaging Assurance

Author: Jieming Pan{2}, Yida Li{2}, Yuxuan Luo{3}, Xiangyu Zhang{2}, Zaifeng Yang{1}, David Liang Tai Wong{2}, Xuhua Niu{2}, Chen-Khong Tham{2}, Aaron Voon-Yew Thean{2}

Affiliation: {1}Agency for Science, Technology and Research / Institute of High-Performance Computing, Singapore; {2}National University of Singapore, Singapore; {3}Zhejiang University, China

Abstract: Using two types of capacitive sensors, a single full plate capacitive electrode and a 14 electrode pair capacitive sensor array in a combined footprint of 306 mm2, micro-particles with an average size of 120 µm incorporated in package seal can be detected and located with a latency 1 µs for full plate sensor and 14 µs for sensor array. Our COMSOL Multiphysics model shows excellent agreement with experimental results, providing a baseline for further electrode optimization. The proposed electro-capacitive technique is non-destructive, has no dependency on the package materials, highly accurate and fast, making it suitable for high throughput production line implementation.

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