WIRE BONDING (PART 1)

Wire bonding (wirebonding) is a process step of semiconductor packaging (assembly). This is part 1 of learning video related to wire bonding process using gold wire ( ball bonding ). You will learn in this video the basics in wire bonding process including bonding cycles, bond parameters for 1st bond ( bonded ball ), 2nd bond ( stitch bond ), and wire loop or loop height.

This video is created and published by Watch Learn 'N Play channel ( @watchlearnnplay ) as part of semiconductor packaging learning video series. This video is intended for beginners. Thank you for watching!

DON'T FORGET TO WATCH SEMICONDUCTOR PACKAGING - WIRE BONDING (PART 2) VIDEO TO LEARN MORE ABOUT WIRE BONDING PROCESS USING GOLD WIRE.