New Product Update: Speed up time to market and increase power density with these pin-to-pin bu

Описание к видео New Product Update: Speed up time to market and increase power density with these pin-to-pin bu

In this session, you will learn about the latest editions to our buck module family that allow for pin-to-pin compatibility across a range of input voltages and output currents.  Specific topics include: 


• Benefits of using a buck module solution vs using a standalone converter


• Product overview of the TPSM33625 (36V Vin, 2.5A Iout) and TPSM365R6 (65V Vin, 600mA Iout)


• Latest advancements in buck module technology
Learn more about TI's New Product Update webinar series
https://www.ti.com/npu
Learn more about the TPSM33625
https://www.ti.com/product/TPSM33625
Download the PDF
https://www.ti.com/lit/SLYP870

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