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Broadcom has released the first XPU based on its 3.5D eXtreme Dimension System in Package (XDSiP) platform technology.

What is this and why is it a game-changer for next-generation XPUs?

Harish Bharadwaj, VP of Marketing, ASIC Product Division from Broadcom explains:

Broadcom announces industry's first 3D face-to-face technology-based custom XPU
The technology enables integration of up to 6,000 mm of silicon and 12 HBM stacks in one packaged device
Broadcom aims to take this technology to volume production in 2026

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