Скачать или смотреть Introducing the Award-Winning Tarantula Underfill | SMTA International 2024

Join us for an exclusive interview from SMTA International 2024 in Rosemont, IL, where Pierre-Jean Cancalon, Head of Marketing at Essemtec, speaks with Don Jeka, Business Development Manager for North America. They present the groundbreaking Tarantula Underfill, Essemtec’s latest innovation in high-precision dispensing.

Recognized with the prestigious Global Technology Award, the Tarantula Underfill offer a new solution for Underfill application with a non-contact heating system, integrated board temperature mapping and control, non-contact dispensing, and the ability to handle large board sizes of up to 560 x 610 mm.

Learn how the Tarantula Underfill enhances electronics reliability by providing superior stress resistance, thermal stability, and durability, making it essential for applications where PCBs are exposed to harsh conditions, such as automotive, aerospace, and industrial environments.

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Key Features
• Award-Winning Innovation: Winner of the Global Technology Award at SMTA International 2024.
• Advanced Non-Contact Heating: Precise temperature control for superior results.
• Versatile Application: Handles board sizes up to 560 x 610 mm while maintaining high accuracy.
• Multi-Function Capabilities: Combines traditional dispensing with advanced underfill applications.

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