Скачать или смотреть Advancing Open Modular Liquid Cooling for Dense Compute at Scale

Introducing Supermicro’s Second-Generation Architecture (DLC-2)

Daniel Kapesa - Product Manager - Liquid Cooling Solution (Supermicro)


As compute density continues to increase with widespread adoption of AI accelerators, efficient and scalable cooling becomes a critical challenge.

The session will examine the next-generation direct-to-chip liquid cooling implementation within Open Rack environments, focusing on how it supports high-density GPU clusters while improving energy, space, and water efficiency.

We will explore lessons learned from integrating this technology into facilities with diverse system architectures and discuss its alignment with OCP's goals around open collaboration, thermal interoperability, and sustainable infrastructure.