Скачать или смотреть Rectangular fins heat transfer analysis through ansys(step by step tutorial 1-2)

Problem Statement:
Electronic components are made up of semiconductors (silicon, germanium) which heat up due to the current flow in it. High temperature can lead to increase / Distorted the internal structure of the components. Some time it is highly undesirable for an electronic component to change its properties (internal resistance, current flow etc.). Such components requires an effective heat transfer mechanism to be installed to function properly. Current Study focuses to design finned surface for the said purpose to restrict a component temperature from crossing a value of 80 Celsius. The components dimensions are 65 mm x 75 mm with following restrictions with space requirements for the fins.
1. The maximum height of the heat sink is 80 mm.
2. The minimum thickness of any fin is 2 mm
3. The minimum distance between any two fins is 3 mm
4. The thickness of the base is fixed at 5 mm.

To solve the problem three type of finned surfaces were analyzed.
1) Rectangular fines with uniform cross sections.
2) Rectangular fines with non-uniform cross section (triangular).
3) Pinned surfaces with uniform circular cross section

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