Cu-to-Cu Direct Bonding Through Highly Oriented Enlarged Cu Grains for Advanced 3D-LSI Applications

Описание к видео Cu-to-Cu Direct Bonding Through Highly Oriented Enlarged Cu Grains for Advanced 3D-LSI Applications

M. Mariappan, GINTI, Tohoku University, Origiinaly presented at IEEE 3DIC 2021

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