Скачать или смотреть True 3D EM Analysis and Thermal Analysis Using Cadence Clarity and Celsius Solvers

Cadence® Clarity™ 3D Workbench was used for the simulation of the PCB and merged SMA connector. The PCB design was directly imported (BRD file or ODB++) and connector mechanical drawing STEP file was used to create a connector model. S parameter of trace (PCB) + connector was extracted. The insertion loss characteristic shows the critical frequencies of this channel and E/M fields are shown over geometries.
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Cadence® Celsius™ Solid Objects Simulation for 3D structures was used for the static thermal simulation of the rigid flex design. Mechanical drawing the STEP file of the rigid-flex design was created in Cadence’s Allegro® PCB Designer and the folding of flex was determined. After importing the STEP file, appropriate materials are assigned to STEP file geometries and imported thermal descriptions. The power input for different components was defined as the appropriate heat transfer conditions. The temperature over flex-rigid geometry was shown. In addition, one example was shown for Celsius Fluid Flow simulation solver, which is used to analyze fluid flow convection, conduction, and radiation heat transfer in systems. Temperature and velocity magnitude of the air flow was shown.
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